ETFE Film Extrusion Line
ETFE film has the characteristics of heat resistance, self-cleaning, non-adhesion, high toughness and high ductility. These properties allow F-40 film to accommodate a variety of sizes and shapes during semiconductor packaging.
Key words:Sheet Extrusion Line

Category:
Solar Extrusion Line

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Description
Process Flows
Extruder —- Screen changer —– Melt pump —– T-die —— Calender —– Thickness Scanner —-Cooling Bracket —-Cuttting Knife —- Haul-off —-Winder
Simple introduction of ETFE film raw material
- ETFE plastic- Ethylene tetrafluoroethylene
- Specific gravity: 1.7 g/cubic centimeter
- Molding shrinkage: 3.1-7.7%
- Molding temperature: 300-330 ℃
Physical property
- Long term use at a temperature of -80 to -220 degrees Celsius, it has excellent chemical corrosion resistance, is resistant to all chemicals, has the lowest friction coefficient among plastics, and has excellent electrical properties. Its electrical insulation is not affected by temperature, and is known as the “king of plastics”.
- Its chemical resistance is similar to that of PTFE, but better than PVDF.
- Its creep resistance and compressive strength are better than PTFE, its tensile strength is high, and its elongation can reach 100-300%. Good dielectric properties and excellent radiation resistance. 1. It is suitable for making corrosion-resistant parts, wear-reducing and wear-resistant parts, sealing parts, insulating parts and medical equipment parts.
- Wire and cable insulation, anti-corrosion equipment, sealing materials, pump valve bushings, and chemical containers.
ETFE Film performance
1. Crystallization material, low moisture absorption. It can be processed into products by the usual thermoplastic processing methods.
2. Poor fluidity, easy to decompose, and produce corrosive gas when decomposed. The molding temperature should be strictly controlled not to exceed 350 degrees, the mold should be heated to 100-150 degrees, and the resistance of the pouring system to the material flow should be small. It can form thin-walled simple products with a thickness of 0.7-0.8 mm.
3. Transparent pellets, injection molding, extrusion molding. The molding temperature is 300-330 degrees, and above 350 degrees is likely to cause discoloration or bubbles. High-speed and low-pressure molding is suitable, and it will be difficult to demould.
ETFE (F-40) fluoroplastics are sourced from DuPont of the United States and Asahi Glass of Japan, and are mainly used in anti-corrosion linings. The material has the corrosion resistance of polytetrafluoroethylene, and at the same time has strong adhesion characteristics to metals, which overcomes the non-adhesion defect of polytetrafluoroethylene to metals, and its average linear expansion coefficient is close to that of carbon steel. The expansion coefficient makes ETFE (F-40) an ideal composite material with metal, and it has excellent negative pressure resistance characteristics.
Application
Dedicated for semiconductor package release
- Release film for printed circuit board
- Release film for semiconductor molding
Special for LED package release
For solar photovoltaic
- Solar battery
- Fuel cell
architectural membrane material
- Membrane structure
- Covering materials for greenhouses
Other uses
- Soundproof material protection film
- Wallpaper Ceiling Protective Film
- Kitchen decoration film
◆ ETFE film Product description:
ETFE film not only possesses excellent heat resistance, self-cleanliness, and non-adhesion properties, but also boasts high tenacity, ductility, and malleability. It is precisely these outstanding characteristics that enable F-40 film to be utilized in a wide range of applications and to conform to different sizes and shapes when used for semiconductor encapsulation. In addition to its durability and versatility, ETFE film is also known for its exceptional optical clarity and resistance to harsh environmental conditions, making it an ideal choice for demanding industrial and technological applications. Overall, the unique combination of properties offered by ETFE film sets it apart as a superior material for various encapsulation and protective purposes in the semiconductor industry.
◆ ETFE film Characteristics:
- High temperature resistance—can be used at 150°C-180°C
- Self-cleaning—low surface tension is not easy to get dirty and easy to clean
- Non-adhesive—the surface is smooth and pollution-free after release
- High ductility – large dimensional strain to meet the needs of different shapes of molds
- Chemical resistance – resistant to harsh conditions such as acids, alkalis, and chemicals
◆ ETFE film Performance Index:
Density | Temperature tolerance | Tensile strength | Percentage of breaking elongation | surface roughness |
1.74g/cm3 | 200℃ | ≥45MPa | ≥300% | frosted 1.4 ± 0.2 µm; mirrored <0.3 µm |
◆ETFE film Standards(Customizable):
Thickness | Width | Length | Surface treatment |
25 µm | 1250 mm | 500 m/roll | Frosted Mirrored |
50 µm | 1250 mm | 500 m/roll | |
60 µm | 1250 mm | 500 m/roll | |
75 µm | 1250 mm | 500 m/roll |
Special engineering film — special for LED package release
Product Description:
It has high temperature resistance, low surface tension self-cleaning, non-adhesive, high toughness and high ductility, and is suitable for LED packages of various shapes and sizes.
Feature:
- High temperature resistance—can be used at 150°C-180°C
- Self-cleaning—low surface tension is not easy to get dirty and easy to clean
- Non-adhesive—the surface is smooth and pollution-free after release
- High ductility – large dimensional strain to meet the needs of different shapes of molds
- Chemical resistance – resistant to harsh conditions such as acids, alkalis, and chemicals
Performance
density | temperature tolerance | Tensile Strength | elongation at break | Transmittance |
1.74g/cm³ | 200℃ | ≥45MPa | ≥300% | 95% |
Specification
thickness | width | length | surface treatment |
50um | 1250/1600mm | 500m/roll |
Matte treatment on the outer surface of the roll; mirror treatment on the inner surface |
75um | 1250/1600mm | 500m/roll | |
25um | 1250/1600mm | 1000m/roll |
Special engineering film — special for solar photovoltaic
Product Description:
It has excellent thermal resistance, making it ideal for use in high-temperature environments. In addition, its low surface tension allows for easy self-cleaning, eliminating the need for frequent maintenance. The non-adhesive property of this material ensures that it will not stick to other surfaces, preventing potential damage or contamination. With its high toughness and ductility, it can withstand harsh conditions and maintain its integrity over time. This material is versatile and can be used for semiconductor packages of all shapes and sizes, providing a reliable and durable solution for electronic components.
Feature:
- High temperature resistance—can be used at -80°C-180°C
- Self-cleaning—low surface tension is not easy to get dirty and easy to clean
- Chemical resistance – resistant to harsh conditions such as acids, alkalis, and chemicals
- High light transmittance—light transmittance over 95%
- Long life—the service life of the natural state is more than 30 years
- Anti-PID—volume resistivity up to 1017
◆ETFE film Performance Index:
Density | Temperature tolerance | Tensile strength | Surface tenson | Transmittance |
1.74g/cm3 | -80~200℃ | ≥45MPa | >42dyne | 95% |
◆ ETFE film Standards(Customizable):
Thickness | Width | Length | Surface treatment |
20 µm | 1250 mm | 3000m/roll | Mirrored Corona |
50 µm | 1250 mm | 1500m/roll | |
100 µm | 1250 mm | 500m/roll |
Special engineering film — special for building material film
Product Description:
It is worth noting that this material also exhibits excellent resistance to high temperatures, allowing it to withstand extreme conditions without losing its structural integrity. In addition, its low surface tension property enables easy self-cleaning, making it ideal for applications where cleanliness is crucial. Furthermore, its non-adhesive nature ensures that it does not stick to other surfaces, reducing the risk of contamination. Moreover, its high toughness and ductility make it highly durable and flexible, able to adapt to various shapes and sizes of semiconductor packages.
Feature:
- High temperature resistance – can be used at -80°C-180°C
- Self-cleaning – low surface tension is not easy to get dirty and easy to clean
- Chemical resistance – resistant to harsh conditions such as acids, alkalis, and chemicals
- High light transmittance – light transmittance above 95%
- Long life – natural state service life of more than 30 years
◆ ETFE film Performance Index:
Density | Temperature tolerance | Tensile strength | Percentage of breaking elongation | Transmittance |
1.74g/cm3 | -80~200℃ | ≥45MPa | ≥300% | 95% |
◆ ETFE film Standards(Customizable):
Thickness | Width | Length | Surface treatment |
200μm | 1250mm | 500m/roll | Mirrored |
100μm | 1250mm | 500m/roll |
NO. | project | Testing Standard | unit | index |
1. | thickness | ASTM-D-882 | μm | 25-100 |
2. | density | ASTM-D-792 | g/cm³ | 1.73 ±0.02 |
3. | Transmittance | GB/T2410-2008 | % | ≥93 |
4. | Haze | GB/T2410-2008 | % | <5 |
5. | elongation at break | ASTM-D-882 | MD (%) | >300 |
TD (%) | >300 | |||
6. | tensile strength | ASTM-D-882 | MD ( Mpa) | >50 |
TD ( Mpa) | >45 | |||
7. | Elastic Modulus | ASTM-D-882 | Mpa | >500 |
8. | tear strength | ASTM-D-1922 | MD ( Mpa) | >300 |
TD ( Mpa) | >400 | |||
9. | Impact strength | ASTM-D-256 | m | >200 |
10. | Shore hardness | ASTM-D-2240 | M | 68-78 |
11. | water absorption | ASTM-D-570 | % | <0.001 |
12. | recommended temperature | – | ℃ | -80-220 |
13. | Dielectric constant | ASTM-D-150 | – | <1.8 |
14. | volume resistance | ASTM-D-257 | Ω .cm | >6.0*1017 |
15. | flame retardant | ASTM-D-2863 | UL-94 | V-O |
16. | water vapor transmission rate | GB/T26253-2010 | g/(m² 。24h) | <20 |
17. | thermal stability | TD2.9%,MD | ||
TD,MD out of shape< 1%150℃ 30min(200℃ 30min) | ||||
18. | Surface Tension | <18 Dyne ( mN/m) |
Other uses
a.Sound insulation material protective film
b.Wallpaper ceiling protective film
c.Kitchen decorative film
Parameter
ETFE film Standards(Customizable):
Thickness Width Length Surface treatment
25 µm 1250 mm 500 m/roll Frosted Mirrored
50 µm 1250 mm 500 m/roll
60 µm 1250 mm 500 m/roll
75 µm 1250 mm 500 m/roll
Application
1.Semiconductor Packaging Release Special
2.Release film for printed circuit boards
3.Release film for semiconductor molding
4.LED packaging release specific
Client

About Gwell

Innovation drives enterprise progress. Relying on the group’s strong technology, equipment strength and innovation spirit, Gwell is committed to the development of high-tech products and the international market. Gwell also actively exchanges and cooperates with world-class scientific research institutions. The new technologies, new processes and new products developed by Gwell are widely used in building materials(PP hollow sheet extrusion machine, PC optic extrusion machine), home appliances(SPC floor extrusion machine), packaging(PET sheet extrusion machine, EVOH film extrusion machine),
medical treatment(PVC rigid sheet extrusion machine), automobiles(TPU film extrusion machine, PVB film extrusion machine), new energy(EVA solar film extrusion machine), aerospace(TPU film extrusion machine), rail transit(waterproof film extrusion machine) and other fields, which are closely related to human life.





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